Technology defines company’s strengths and production capabilities as we employ epitaxial methods to create the advanced materials at the core of electronic devices. The epitaxy process involves depositing multiple, varied mono-crystalline layers on a substrate material, resulting in complex structures with unique electrical characteristics. It is a technique used widely in nanotechnology and advanced semiconductor fabrication.
Using AIXTRON’s Metal Organic Chemical Vapour Deposition (MOCVD) multi-wafer system, we produce exceptionally high-quality epitaxial structures. The Laytec’s MOCVD in-situ monitoring also allows measurements that provide precise control of the growth process. Our Aixtron 2800 G4 reactor is capable of handling several up to 6 inch wafers in one run.
Reliability is one of our core values. We test all products comprehensively using electron microscopy, X-ray diffraction, atomic force microscopy, photoluminescence, Hall effect equipment, SIMS, XPS and more to ensure quality and uniformity. Our team includes specialists in theoretical physics applied to semiconductor materials as well as measurement specialists who analyse and interpret the results accurately.